dual in-line package

In electronics, a Dual In-line Package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and a row of electrical connecting pins along each of two opposite sides, usually the longer sides of the rectangle. Note: DIPs may be used for integrated circuits ("chips"), like microprocessors, or for discrete components such as resistors or toggle switches. A typical DIP may be a microcircuit package with two rows of seven vertical leads that is specially designed for mounting on a printed circuit board. JEDEC-standard DIPs have the inter-lead spacing specified as 0.1" (2.54 mm) and the row spacing is specified at 0.3" (7.62 mm).

Sources

Federal Standard 1037C
Intel (1996). Packaging (databook). ISBN 1-55512-254-X.

<< Previous

Word Browser

Next >>

direct connect
direct distance dialing
directional coupler
directive gain
direct sequence spread spectrum
disengagement originator
dispersion limited operation
distortion
distortion limited operation
distributed database
distributed queue dual bus

distributed switching
disturbance voltage
diurnal phase shift
diversity reception
dod master clock
double ended synchronization
double sideband reduced carrier transmission
double sideband suppressed carrier transmission
doubly clad fiber
d region
drift

drop (liquid)
drop and insert
dropout
dual access
duct
duobinary signal
duplexer
duty cycle
dynamic range
earth terminal complex
echo (mythology)

effective data transfer rate
effective earth radius
effective height
effective input noise temperature
effective mode volume
effective power
effective transmission rate
efficiency factor
eia interface
electrical length
electric field